High viscous pastes are extruded in the multi-material process via a nozzle to build up a 3Dimensional body layer by layer. The pastes are formed by the powders of copper, iron, or other metallic materials and their alloys, as well as ceramic powders.
As per the geometry of the body to be printed with an offset that is specially tailored binders. Once the printing part is over, the green body dries up for sufficient strength for subsequent heat treatment.
While sintering, the binder is expelled and the metallic or ceramic particles are fused together. The volume is reduced with the leads that must be considered in creating the CAD data.
The 3D multi-material process strength is in the possibility of using several materials in the printing process.
One of the examples is, that the electrically conductive structures that are made of copper can be printed together with the insulation. It consists of superior ceramic materials to conventional organic insulation materials that are made of plastic in physical properties, such as heat resistance or thermal conductivity.
In the process, the electrical coils are significant with high-temperature resistance that can be produced. In combination with ferromagnetic materials such as iron, entire electrical machines, and components are also produced in a single printing process.
One of the best features is the process to allow self-supporting structures with bodies that are with closed and empty cavities to produce. The inner structures also offer interesting approaches for efficient active or passive cooling concepts.
The support structures are used with almost any 3Dimensional shape. The process is characterized by high material efficiency. And almost the material that can be used for the printing process.
The important reason for the specialty of the ceramic and metallic pastes in the 3D printing technology is “After the printing process, these are sintered together with the printed chip.” Prof. Dr. Ralf Werner, Professor of Electrical Energy Conversion Systems and Drives at the Chemnitz University of Technology.